Canon and IPC have joined together to create the definitive exhibition and conference for the Midwest's electronics manufacturing marketplace.
In addition to the exhibition, IPC will present a renowned technical conference where attendees can take advantage of new research and process innovations from key industry leaders in the areas of printed board fabrication and design and electronics assembly. Past topics include advanced packaging, lead-free quality and reliability, new substrates and materials, new environmental compliance challenges including REACH and RoHS, embedded components, and more. IPC will also present professional development courses and standards development meetings during the event.
